Journals

-

"An Analysis of a Vibratory Angular-rate Gyroscope using Polarized Piezoceramic Bimorph Plates: Part I - Derivation of Variational Equations in the Absence of Angular Velocity”, Jongwon Seok, H.F. Tiersten and H.A. Scarton, Journal of Sound and Vibration, 280(1-2), pp. 263-287, 2005.

-

"Dispersion Relations for Cylindrical Bending Motions of Polarized Piezoceramic Bimorph Plates with Two Facing Edges Free," Jongwon Seok, International Journal of Solids and Structures, 42(7), pp. 1957-1981, 2005.

-

"Thermal Cycling Effects on Bond Strength and Residual Stress in Benzocyclobutene(BCB)-Bonded Wafers”, Yongchai Kwon, Jongwon Seok, J.-Q. Lu, T.S. Cale and R.J. Gutmann, Journal of the Electrochemical Society, 152(4), pp. G286-G294, 2005.

-

"An Evaluation Process of Polymeric Adhesive Wafer Bonding for Vertical System Integration”, Yongchai Kwon and Jongwon Seok, Japanese Journal of Applied Physics Part 1, 44(6A), pp. 3893-3902, 2005.

-

“Separating Contribution from Two Coherent and Interfering Inputs”, V.V. Lenchine and Jongwon Seok, Journal of Sound and Vibration, 287(1-2), pp. 374-382, 2005.

-

"Thermo-chemical destruction of polychlorinated biphenyls (PCBs) in waste insulating oil”, Jonghyuk Seok, Jongwon Seok and Kyung-Yub Hwang, Journal of Hazadous Materials, 124(1-3), pp. 131-136, 2005.

-

"Dynamic characteristics of a beam angular-rate sensor", Jongwon Seok and H.A. Scarton, Journal of Mechanical Sciences 48(1), pp. 11–20, 2006.

-

"Critical Adhesion Energy of Benzocyclobutene-Bonded Wafers", Yongchai Kwon, Jongwon Seok, J.-Q. Lu, T.S. Cale, and R.J. Gutmann, Journal of The Electrochemical Society, 153(4), pp. G347-G352, 2006.

-

“A study on the fabrication of curved surfaces using magnetorheological fluid finishing”, Jongwon Seok, Yong-Jae Kim, Kyung-In Jang, Byung-Kwon Min and Sang Jo Lee, International Journal of Machine Tools & Manufacture 47, pp. 2077-2090, 2007.

-

“Critical Adhesion Energy at the Interface Between Benzocyclobutene and Silicon Nitride Layers”, Yongchai Kwon, Jongwon Seok, J.-Q. Lu, T.S. Cale and R.J. Gutmann, Journal of Electrochemical Society, 154(6), pp. 460-465, 2007.

-

“Evaluation of BCB Bonded and Thinned Wafer Stacks for Three-dimensional Integration", Yongchai Kwon, Anurag Jindal, Rod Augur, Jongwon Seok, T.S. Cale, R.J. Gutmann and J.-Q. Lu, Journal of the Electrochemical Society, 155(5), pp. H280-H286, 2008

-

“Modeling of chemical-mechanical polishing considering thermal coupling effects", Seunghee Oh and Jongwon Seok, Microelectronic Engineering, 85(11), pp. 2191-2202, 2008